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IC packaging, also called IC assembly, is a major process and technology in the IC manufacturing, as it helps in connecting the bare die with the printed circuit board (PCB). In the electronic manufacturing industry, IC packaging is the final stage of the semiconductor device fabrication, in which the small block of semiconductor material is being enclosed to guard the devices from corrosion or physical damage. The IC packaging market is witnessing growth due to the growing adoption of ICs in various electronic devices like smartphones, tablets, laptops, cameras, and others. There are various types of materials that are used in the IC packaging such as thermal interface materials, organic substrates, bonding wires, solder balls, die attach materials, encapsulation resins, ceramic packages, and lead frames.
The IC packaging market is expected to witness high growth over the coming years due to the growing demand for consumer electronics across the globe. Moreover, the increasing usage of data centers and cloud computing has resulted in an increase in demand for servers, high-end computing, and data centers. Moreover, the miniaturization of electronic devices is growing rapidly due to the relative ease in miniaturizing the electronics, which further propels the growth of the IC packaging market.
Growing technological advancements have increased the adoption of IC packaging materials. The increasing awareness about the effectiveness of electronic packaging materials in various applications is boosting the growth of the IC packaging market. For instance, these materials are primarily being used in the optoelectronics and imaging, memory, LED, sensors and MEMS, logic, and others. However, the fluctuating prices of raw materials is hindering the growth of the market. On the other hand, the key players in the market are expected to enter the untapped areas in emerging economies for revenue generation, which will create opportunities in the market.
This industry study presents the global IC Packaging market size, historical breakdown data (2014-2019) and forecast (2019-2025). The IC Packaging production, revenue and market share by manufacturers, key regions and type. The consumption of IC Packaging in volume terms are also provided for major regions such as United States, Europe, China, Japan, South Korea and Other Regions. This study also analyzes the IC Packaging market status, shares, growth opportunities, future trends, key drivers, challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
Top players in IC Packaging market covered in this report are ASE, Amkor, SPIL, STATS ChipPac, Powertech Technology, J-devices, UTAC, JECT, ChipMOS, Chipbond.
IC Packaging market splits by End Users like CIS, MEMS, Others. Types of IC Packaging are DIP, SOP, QFP, QFN, BGA, CSP, LGA, WLP, FC, Others.
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This report provides the estimation of market size and volume. Both top-down and bottom-up approaches have been used to estimate and validate the market size of IC Packaging market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Major Points from Table of Contents
1 Study Coverage
2 Executive Summary
3 Market Size by Manufacturers
4 IC Packaging Production by Regions
5 IC Packaging Consumption by Regions
6 Market Size by Type
7 Market Size by Application
8 Manufacturers Profiles
9 Production Forecasts
10 Consumption Forecast
11 Value Chain and Sales Channels Analysis
12 Market Opportunities & Challenges, Risks and Influences Factors Analysis
13 Key Findings in the Global IC Packaging Study
14 Appendix
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