—
2016 global fan-in wafer level packaging market research says one trend gaining popularity in this market is increase in wafer size. The global semiconductor industry witnessed an increase in the size of silicon wafers, from 100 mm to 300 mm, during the last four decades. The shift to larger diameter wafers reduces the cost of manufacturing semiconductor ICs by 20%-25%. At present, the industry predominantly uses 300-mm wafers to manufacture ICs. This trend is expected to maintain its momentum during the forecast period.Complete report on fan-in wafer level packaging market spread across 62 pages, analyzing 4 major companies and providing 38 data exhibits are now available at http://www.reportsnreports.com/reports/738713-global-fan-in-wafer-level-packaging-market-2016-2020.html
The following companies are the key players in the global fan-in wafer level packaging market: STATS ChipPAC, STMicroelectronics, TSMC, and Texas Instruments. Other Prominent Vendors in the market are: Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, and FlipChip International.
According to the fan-in wafer level packaging market report, the surging demand for compact electronic devices in sectors such as telecommunications, automotive, industrial manufacturing, and healthcare has generated the need for miniaturized semiconductor ICs. With the emergence of products such as 3D ICs and MEMS devices, the electronic equipment is becoming compact and user-friendly, which involves changes in IC designing such as finer patterning. Order a copy of Global Fan-in Wafer Level Packaging Market 2016-2020 report @ http://www.reportsnreports.com/purchase.aspx?name=738713
The analog and mixed ICs accounted for around 72% of the global fan-in wafer level packaging market in 2015 and is expected to grow at a steady rate during the forecast period. In 2015, MEMS and sensors accounted for around 9% of the global fan-in WLP market. The key revenue generators of the global MEMS market are the consumer electronics and automotive segments. Logic and memory ICs will grow at a CAGR of around 6% in the global fan-in wafer level packaging market, during the forecast period. The requirement for high-powered processors, especially for the automation purposes, has prompted the demand for fan-in WLP solutions in the logic IC segment, as they form an integral part of IC packaging at the manufacturing level.
The report, Global Fan-In Wafer Level Packaging Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. This report covers the present scenario and the growth prospects of the global fan-in wafer level packaging market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of packaged fan-in WLPs in various application segments such as analog and mixed IC, wireless connectivity, logic and memory IC, micro-electro-mechanical systems (MEMS) and sensors, and complementary metal-oxide-semiconductor (CMOS) image sensor
In terms of geographical regions, APAC will be the major revenue contributor to the fan-in wafer level packaging market throughout the next four years. This is mainly due to the presence of a number of semiconductor foundries in this region. Moreover, the rise in demand for semiconductor devices due to the presence of prominent consumer electronics manufacturers, such as Samsung, Sony, LG, Toshiba, and Panasonic, will also bolster this market’s growth prospects.
About Us:
ReportsnReports.com is your single source for all market research needs. Our database includes 500,000+ market research reports from over 100+ leading global publishers & in-depth market research studies of over 5000 micro markets. With comprehensive information about the publishers and the industries for which they publish market research reports, we help you in your purchase decision by mapping your information needs with our huge collection of reports.
Contact Info:
Name: Ritesh Tiwari
Email: Send Email
Organization: ReportsnReports
Phone: 1 888 391 5441
Website: http://www.reportsnreports.com/reports/738713-global-fan-in-wafer-level-packaging-market-2016-2020.html
Release ID: 143467
Google
RSS